Zdeněk Plíva
This presentation will present the current developments in the field of Additive Manufacturing of Electronics (AME), with respect to the technical facilities of TUL, and comment on possible future developments in printed circuit board design. We will start with the current state of the art in current PCB technology, general information on the AME process and the potential of AME, the application of new ideas in the design of RF applications, multilayer and complex high density interconnects - HDI, non-planar transmission lines, component embedding and encapsulation, and electromechanical printed devices. Finally, we will show the current achievements in the field of printed electronics at TUL.